Conference Papers

  1. Goodson, K.E., Agonafer, D.D., Asheghi, M., Barako, M., Cho, J., Gorle, C., Houshmand, F., Liu, T., Palko, J., Santiago, J., Sood, A., Won, Y., Zhang, C., “Near Junction Transport and the Limits of Electronics Cooling”, InterPack & ICNMM, July 6-9, 2015, San Francisco, CA
  2. Jung, K.W., Agonafer, D.D., Lee, H., Palko, J., Won, W., Ashehi, M., Goodson, K.E., “Geometric pinning effect and evaporative heat transfer for low surface energy liquids on an array of silicon microshells”, The Intersociety on Thermal and Thermomechanical Phenomena in Electronic Systems, May 31-June 3, 2016, Las Vegas, NV.
  3. Palko, W.J., Lee, H., Agonafer, D.D., Jung, KW, Barako, M., Houshmand, F., Rong, G., Gorle, C., Won, Y., Asheghi, M., Santiago, J.G., Goodson, K.E., “High Heat Flux Two-Phase Cooling of Electronics with Integrated Diamond/Porous Copper Heat Sinks and Microfluidic Coolant Supply”, Submitted to The Intersociety on Thermal and Thermomechanical Phenomena in Electronic Systems, May 31-June 3, 2016, Las Vegas, NV.
  4. Won, Y., Lee, H., Jung, K.W., Barako, M., Zhang, C., Houshmand, F., Palko, J., Agonafer, D., Asheghi, Santiago, J., Goodson, K., “Temperature Dependent Wettability of Copper Inverse Opals”, 9th International Conference on Boiling and Condensation Heat Transfer, April 26-30, 2015, Boulder, CO, USA.
  5. Palko, J., Houshmand, F., Wilbur, J., Zhang C., Dusseault, T., Won, Y., Lee, H., Barako, M., Agonafer, D.D., Jung, K.W., Asheghi, M., Santiago, M., Goodon, K.E., “Capillary Fed Two Phase Cooling Beyond 1 kW/cm2 in Short Wicking Length, Joule-Heated, Microporous Copper Layers,” 9 th International Conference on Boiling and Condensation Heat Transfer, April 26-30, 2015, Boulder, CO, USA (Poster Award).
  6. Palko, J., Houshmand, F., Wilbur, J., Zhang C., Dusseault, T., Won, Y., Lee, H., Barako, M., Agonafer, D.D., Jung, K.W., Asheghi, M., Santiago, M., Goodon, K.E., “Capillary Fed Two Phase Cooling Beyond 1 kW/cm2 in Short Wicking Length, Joule-Heated, Microporous Copper Layers,” submitted to 9th International Conference on Boiling and Condensation Heat Transfer, April 26-30, 2015, Boulder, CO, USA.
  7. Agonafer, D.D., Palko, J., Won, Y., Lopez, K., Dusseault, T.J., Gires, J., Asheghi, M., Santiago, J.G., Goodson, K.E., “Progress on Phase Separation Microfluidics”, Compound Semiconductor Integrated Circuit Symposium (CSICS), 2014, IEEE, Oct 20-21, San Diego, CA, USA.
  8. Won, Y., Cho, J., Agonafer, D.D., Asheghi, M., & Goodson, K. E. (2013, October). “Cooling Limits for GaN HEMT Technology”, Compound Semiconductor Integrated Circuit Symposium (CSICS), IEEE, 2014, Oct. 20-21, San Diego, CA, USA. IEEE (pp. 1-5).
  9. Won, Y., Cho, J., Agonafer, D.D., Houshmand, F., Asheghi, M., & Goodson, K. E. (2013, October). “Microfluidics Heat Exchangers for High Power Density GaN on SiC”, In Compound Semiconductor Integrated Circuit Symposium (CSICS), 2014, IEEE, Oct 20-21, San Diego, CA, USA.
  10. Agonafer, D.D., Lopez, K., Won, Y., Palko, J., Asheghi, M., Santiago, J.G., Goodson, K.E., “Phase-Separation of Wetting Fluids Using Nanoporous Alumina Membranes and Micro-GLASS Capillaries”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 20 – 20, Orlando, FL, USA.
  11. Dusseault, T.J., Gires, J., Barako, M.T., Won, Y., Agonafer, D.D., Asheghi, M., Santiago, J.G., Goodson, K.E., “Inverse Opals for Fluid Delivery in Electronics Cooling Systems”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2014, May 27 – 30, Orlando, FL, USA.
  12. Won, Y., Cho, J., Agonafer, D.D., Asheghi, M., & Goodson, K. E. (2013, October). “Cooling Limits for GaN HEMT Technology”, In Compound Semiconductor Integrated Circuit Symposium (CSICS), 2013 IEEE (pp. 1-5). IEEE. Agonafer, D. D., Chainani, E., Oruc, M. E., Lee, K. S., & Shannon, M. A. (2012, July). “Surface Characterization Studies of Thiols as a Blocking Mechanism for Specific Adsorption for Application of Charge Selective Membrane Transport”, ASME 2012 Heat Transfer Summer Conference collocated with the ASME 2012 Fluids Engineering Division Summer Meeting and the ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels (pp. 795-799). ASME.
  13. Agonafer, D. D., Chainani, E., Oruc, M. E., Lee, K. S., & Shannon, M. A. (2011, January). “Study of Alkane Thiols as a Blocking Mechanism for Specific Adsorption for Application of Charge Selective Membrane Transport,” In ASME 2011 International Mechanical Engineering Congress and Exposition (pp. 559-567). ASME.
  14. Smith, B., Romero, D., Agonafer, D.D., Gu, J., & Amon, C. H., “Aerogel for Microsystems Thermal Insulation: System Design and Process Development,” In ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (pp. 753-762). ASME.
  15. Agonafer, D.D., Ibarra, J., McGee, K., Platt, Frank; Harris, K., Agonafer, D., “Heat Pipe Optimization Team: The Heat Pipe Assisted Heat Sink Project,” Innovations in Engineering Education 2004: Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, Innovations in Engineering Education 2004:Mechanical Engineering Education, Mechanical Engineering Technology Department Heads, 2004, pp. 363-37212.
  16. Agonafer, D.D., Markell, J., Sammakia, B., & Lehmann, G. (2004, June), “Numerical investigation of enclosure effects on spot cooling devices”, Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM’04. The Ninth Intersociety Conference on (pp. 339-343). IEEE.

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