As the demand for higher performance electronics continues its exponential growth, transistor density doubles every 18 to 24 months. Electronic devices with high transistor density generate heat and thus require thermal management to improve reliability and prevent premature failure. Demanding performance specifications result in increased package density, higher heat loads and novel thermal management technology. This course gives an overview of thermal management for micro/power electronics systems and helps engineers to develop a fundamental understanding of emerging thermal technologies. This course will include the following topics: Background of electronics packaging; thermal design of heat sinks; single phase and multiphase flow in thermal systems; Two-phase heat exchange devices for portable and high powered electronic systems; Computational fluid dynamics for design of thermal systems. Prerequisites: Senior or graduate standing. For more information, look under Course Listings in WebSTAC.